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NanoAIM NanoAIM (Nanoscale Adaptive Incisive Microwave) Technology provides innovative microwave-based thermal processing, bonding and packaging solutions for the semiconductor nano-device manufacturing industry. NanoAim’s patent-pending technology is capable of delivering rapid (1,000oC/sec – 1,000oC/millisec) and selective heating of targeted materials with minimal damage to adjacent structures. Applications include high temperature “spike” anneals and bonding and packaging of nanodevices. By overcoming key challenges hindering existing products, NanoAIM’s solutions enable its customers to build faster, smaller, and more power efficient devices, reduce manufacturing costs and shorten “time-to-market” for next-generation devices. NanoAIM has completed a working prototype. The patent-pending technology has recently received an SBIR Phase I award from the National Science Foundation. There are currently four NanoAIM team members with a combined 50 years of research and industry experience in semiconductor equipment and microwave engineering. Contact Information Mark Tian Last Modified 8/31/06 10:44 AM | Hide Tools |